摘要
以二苯基硅二醇(DPSD)、3-环氧丙氧基丙基三甲氧基硅烷(GPTMS)和3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷(MPMS)等为原料,通过非水解溶胶-凝胶法合成了含环氧基和丙烯酸酯基苯基硅树脂(PSREA),并将其用作高折射率加成型有机硅封装胶的增粘剂。采用FT-IR、~1H NMR和^(29)Si NMR对PSREA的结构进行了表征,并研究了其对有机硅封装胶性能的影响。结果表明,当PSREA用量为1.5份时,有机硅封装胶的综合性能较佳,其剪切强度为4.43 MPa,比未加增粘剂时提高了71%,拉伸强度为3.61 MPa,拉断伸长率为51%,邵尔D硬度为49度,折射率为1.532,黏度为2 950 m Pa·s。
A phenyl silicone resin with epoxy and acrylate group(PSREA) was synthesized by the reaction of diphenylsilanediol(DPSD),3-glycidoxypropyltrimethoxysilane(GPTMS) and 3-methacryloyloxypropylmethyldi-methoxysilane(MPMS),and it was used as the adhesion promoter for addition-cure silicone encapsulant with high refractive index. FT-IR,~1H-NMR and ^(29)Si-NMR were used to characterize the structure of PSREA,and the influence of PSREA on the properties of silicone encapsulant was investigated. Results show that when the content of PSREA is 1. 5 phr,silicone encapsulant has good comprehensive performance. The shear strength is 4. 43 MPa,which is 71% higher than that of the encapsulant without the adhesion promoter.The tensile strength of is 3. 61 MPa,the elongation at break is 51%,the Shore D hardness is 49,the refractive index is 1. 532,and the viscosity is 2950 mPa·s.
出处
《有机硅材料》
CAS
2018年第S1期15-19,共5页
Silicone Material
基金
佛山市重大科技项目应用型核心技术攻关领域(2016AG101015)
