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P对Sn-0.7Cu-0.05Ni-0.07Ce焊料合金组织和性能的影响 被引量:3

Effect of P on Microstructure and Properties of Sn-0.7Cu-0.05Ni-0.07Ce Solder Alloy
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摘要 以Sn-0.7Cu-0.05Ni-0.07Ce无铅焊料合金为基础,制备出Sn-0.7Cu-0.05Ni-0.07Ce-xP(x=0%、0.1%、0.01%、0.001%)焊料合金。研究P元素含量对Sn-0.7Cu-0.05Ni-0.07Ce焊料合金显微组织、熔程、润湿性、抗氧化性性能的影响。利用光学显微镜(OM)和扫描电子显微镜(SEM)观察焊料合金的显微组织,采用X射线衍射仪(XRD)进行焊料合金的物相分析,通过差示扫描量热分析仪(DSC)测定焊料合金熔点,采用铺展性试验法和润湿平衡法测定焊料的润湿性,采用静态刮渣法测定焊料的抗氧化性。结果表明,P具有细化Sn-0.7Cu-0.05Ni-0.07Ce焊料合金晶粒的作用;随着P含量的增加,焊料合金的熔程逐渐减小,在P含量为0.01%时焊料合金的熔化特性最佳,初始熔化温度为230.3℃、熔程5.1℃;焊料的润湿时间由0.73s升至0.74s,润湿力和铺展面积由0.98mN、0.54mm^2降至0.88mN、0.45mm^2;焊料的抗氧化性先增大后减小,在P含量为0.01%时抗氧化性能最好,氧化渣产率为0.146g/(min·cm^2)。 Sn-0.7 Cu-0.05 Ni-0.07 Ce lead-free solder alloy was selected as a base alloy,the effects of P content on the microstructure,melting range,wettability and oxidation resistance of the solder alloy were investigated.The microstructure of the solder alloys was observed by Optical Microscope(OM)and Sscanning Electron Microscope(SEM).The phase analysis of the solder alloys was analyzed by X-ray diffraction(XRD).The melting point of the solder alloy was measured by Differential Scanning Calorimetry(DSC).The wettability of the solder on Cu substrate was investigated by the spreading test method and wetting balance method.The oxidation resistance of the solder were investigated by a static scraping method.The results show that P has the effect of refining the grain of Sn-0.7 Cu-0.05 Ni-0.07 Ce solder alloy;the grain size of solder alloy decrease gradually with the increase of the P content.The melting range of solder alloy decrease with the increase of the P content,when the P content was0.01%,the melting characteristic of solder are the best.The initial melting temperature is 230.3℃and melting range is 5.1℃.The wetting time increases from 0.73 sto 0.74 sand the wetting force and spreading area reduces from 0.98 mN,0.54 mm^2 to 0.88 mN,0.45 mm^2,respectively.The oxidation resistance of solder first increases and then decreases with the increase of the P content.The oxidation resistance is best when the P content is 0.01%,and the oxidation slag yield is 0.146 g/(min·cm^2).
作者 滕媛 陈东东 白海龙 吕金梅 甘有为 严继康 TENG Yuan;CHEN Dongdong;BAI Hailong;LV Jinmei;GAN Youwei;YAN Jikang(Yunnan Tin and Materials Co.,Ltd.,Kunming 650501,China;Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China)
出处 《有色金属工程》 CAS 北大核心 2019年第3期24-29,共6页 Nonferrous Metals Engineering
基金 国家重点研发计划项目(2017YFB0305700) 云南省重大科技专项计划项目(2018ZE004)~~
关键词 SnCuNi合金 P含量 显微组织 润湿性 SnCuNi alloy P content microstructure wettability
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