从PCB的材料构成谈信号完整性

Approaching SI performance from PCB material composition

在云计算、大数据等颠覆性技术和理念迅猛发展的背景下,PCB产业受到了前所未有的冲击。高频、高速PCB得到了广泛的应用。区别于传统更侧重PCB热可靠性能,现今更多的PCB产品更着重考虑的是PCB的SI(信号完整性)性能。提高PCB信号完整性,板材的选择是重中之重。选定了板材之后,接下来对玻布、树脂含量和铜箔的选择也是至关重要的。文章针对PCB板材的基本组成分别讨论,以相应的实验结果有力的说明了如何选择合适的玻布、树脂含量和铜箔的方法。

As Cloud Computing and Big Data technology and theory developing rapidly, PCB industry is coming across a technical impact. High frequency and high speed PCBs have been widely used in every technical area. Not like traditional PCB featured in emphasizing thermal reliability, SI(Signal Integrity) performance is becoming the most important aspect for modern PCB products. To improve PCB SI performance, the materials selected are the first consideration. When materials are settled, the next is to choose glass style, prepreg and copper foil, which is even more important. The article approaches PCB signal integrity from the basic composition of materials, gives the evidences of choosing the right glass style, resin content and copper foil.