超高层数的背板制作中厚板压合过程的影响因素研究

Study on the key influence factors of thick board lamination for ultra-multilayer backplane technology applications

随着通信技术的发展,对印制电路板制造技术的技术指标要求越来越高。高密度布线的需求使印制电路板越来越厚,厚板的压合成为印制电路板制造技术的难点。尤其是在高层数背板制作技术的开发中,厚板间压合对位精度制约了整板的电气性能,文章通过对压合参数,叠层方法,定位方式,材料拉伸系数选择等关键因素分析,得出了适合于厚板压合的技术方案,提高厚板压合的对位精度,改善厚板压合中易出现的错位,缺胶和空洞等问题。

With the development of communication technology, the technical index of printed circuit board manufacturing demand got higher with years. The demand of High-density wiring driven the thickness of printed circuit board increased rapidly; the thick plate lamination of printed circuit board gradually became a manufacturing technology difficulty. Especially in new ultra-multilayer backplane technology, large size and thick plate lamination have a great influence on the registration accuracy of Z-axis interconnection, which restricted the electrical performance of the whole PCB. In this paper, the effects of key factors on pressure, such as the pressing parameter, laminated method, fixed mode, drawing coefficient selection of materials, were studied. The best lamination technology solutions suitable for thick plate had been obtained, the registration accuracy of the thick plate pressure was improved, the common problem of thick board lamination such as malposition, lack of glue and hollows were also solved.