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一种新型铜槽模型对电镀均匀性提升的研究 被引量:4

One new model of plating tank on improving the COV of plating
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摘要 文章主要根据传统的电镀铜理论,建立了一个新型的镀铜槽模型,对阴极电流传输方式、阴极冷冻方式、夹具优化、阳极挡板调整、阴阳极之间的距离等方面进行优化,电流从整流机传输至飞巴顶部再均分至夹具的传输方式,电流分布尖端效应影响明显处进行挡板、打孔处理,优化了电力线的分布,达到了提高垂直电镀线电镀厚度均匀性目的;实验结果表明:整个飞巴的极差小于8.5mm,COV达到4.8%,效果显著。 In this article, we make a new model of plating tank according to the electroplating theory. We optimize the transfer method of the electric current on the cathode, and optimize the anode baffle of panel electroplating, and optimize the distance between the anode and cathode. The electricity transfers from the rectifier to the top of the fly bar and then distribute to the clamp averagely. We add anode baffle and drilling holes in the excess baffle to reduce the point effect., and the electric field distribution is optimized. Analysis data shows that the whole evenness is 8.5um and COV is 4.8%. The result is good.
作者 凌家锋
出处 《印制电路信息》 2015年第3期117-121,共5页 Printed Circuit Information
关键词 电镀均匀性 电流传输 尖端效应 阳极挡板 Electrolytic Plating Evenness Electrical Distribution Edge Effect Anode-Baffle
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