18层背板型刚挠结合板制作技术介绍

The 18 layer backplane type rigid flex PCB production technology introduction

大型工控设备等领域通常需要用到尺寸较大PCB,刚挠结合板也不例外,高厚度和大尺寸对此类刚挠结合板制作提出了新的技术要求。文章介绍了一款18层(5R+6F+7R)、200mm×700mm刚挠结合板层偏控制、软板区域成型等技术,为大尺寸高多层刚挠结合板制作提供技术依据。

Large industrial equipment and other fields often need to use larger size PCB, Rigid Flex PCB is no exception. High thickness and large size and puts forward the requirements of new technology on this kind of rigid Flex PCB production. This paper introduces partial control, soft board area forming technology about an 18 layer(5R+6F+7R), 200mm×700mm Rigid Flex PCB, to provide technical basis for large size high multilayer rigid Flex PCB production.