摘要
介绍一种铜面化学前处理的方法----无机酸超粗化处理工艺,该工艺没有一般的硫酸-双氧水体系超粗化易受氯离子污染的缺点,且运作成本远远低于有机酸超粗化;该工艺用于干膜/阻焊油墨前处理,可提高干膜/绿油与铜面的结合力。
The paper introduces a type of Pretreatment process, with which we create a super-roughened copper surface. This Process has no shortcomings of chloride ion pollution in super-roughening of sulfuric acid/hydrogen peroxide system, and the operation cost is much lower than the organic acid super roughening, This process specifically suits for dry film/solder mask pretreatment process of PCB. With the application of supper roughening process, binding force in copper surface has been improved.
出处
《印制电路信息》
2015年第4期11-12 19,共3页
Printed Circuit Information
关键词
超粗化
抗氯离子
前处理
高密度互连
阻焊剥离
Supper Roughening
Resistance to Chloride Ion
Pretreatment
HDI
Solder Mask Peeling