丝印钉床设计对阻焊厚度均匀性的影响

Effect on SM thickness uniformity by nails-bed dsesign

在PCB阻焊制作过程中,使用丝印钉床实现PCB连续双面印刷液态阻焊的工艺应用十分广泛,但是由于不同PCB设计上的巨大差异,导致丝印钉床的制作较为困难。一旦钉床上的铜钉布设不合理,极易导致PCB板面油厚不均,轻则造成产品阻焊外观色差,重则造成板面阻焊显影不良或断阻焊桥,导致返工或报废。因此使用不同板厚的印制板,调整丝印钉床布钉间距,评价不同布钉间距、不同板厚下的阻焊厚度均匀性,为不同厚度PCB板的丝印钉床布钉间距设计提供指导。

Double-sided silkscreen solder mask using nails-bed is widely used in PCB solder mask processing. But nails-bed preparing is diffi cult due to the PCB design difference. Improper nails-bed leads to poor solder mask thickness uniformity which resulted SM visual disparity, poor development and bridge broken. Solder mask thickness uniformity on different thickness board by different nails-bed is studied and nails-bed design advising is raised after the study.