化学镀厚铜、有机导电膜、黑孔化工艺比较

Comparison of electroless thick copper plating,organic conductive fi lms and black hole

对孔金属化及线路板制造流程进行了简单介绍,对孔金属化改进工艺之化学镀厚铜以及取代孔金属化的直接电镀的有机导电膜和黑孔化等工艺进行了比较,黑孔化具有环保、操作简单、适用范围较广等特点,值得推广。

The plated through hole and the circuit board manufacturing process were introduced in this paper. The improvement of plated through hole technology of electroless thick copper plating and replacement of the direct plating of organic conductive film and black hole were compared. The Black Hole environmental protection, simple operation, characteristics such as wide range of application, is worth promoting.