大铜面镀薄金印制板的加工工艺

The thin gold plating process for large copper surface of PCB

针对大铜面电镀薄金印制板,采用金面覆盖干膜抗蚀层的方法,解决了薄金不抗碱性蚀刻以及金面损伤和金层砂眼等问题,使成品率达到95%以上,生产实践验证了该加工工艺的有效性。

Aiming at the large copper surface electroplating thin gold PCB, and by using the method of dry fi lm of the resist etch layer covering the gold surface, we solves the problem that thin gold can't resist anti-alkaline etching, gold surface damaging, gold layer cavity created etc, making the fi nished product rate reached more than 95%. The production practice has verifi ed the validity of the machining process.