摘要
介绍了320×240非制冷红外头盔成像单元的基本原理,以及基于片上系统设计非制冷红外头盔热成像电路单元的方法,给出了现场可编程阵列功能组成框图。在分析成像电路结构的基础上,重点介绍了A/D转换、非均匀性校正及显示控制等关键技术,对主要驱动信号进行了仿真,结果表明:采用单片高性能的现场可编程器件,基于片上系统方法设计非制冷红外头盔成像电路是可行的。
The principle of 320×240 UFPA helmet imaging circuit is discussed. The method of design based on SOC is introduced. Furthermore the block diagram for FPGA is given in this paper. On the basis of analysis of the structure of UFPA helmet imaging circuit, the key problems for the A/D converter, NUC and liquid crystal display controller are introduced. Main driving timing sequences are simulated. The simulation result demonstrates the validity of the design of UFPA helmet imaging circuit based on SOC using FPGA.
出处
《红外与激光工程》
EI
CSCD
北大核心
2003年第6期577-579,共3页
Infrared and Laser Engineering
关键词
片上系统
非制冷红外头盔成像电路
现场可编程门阵列
System On a Chip(SOC)
UFPA helmet imaging circuit
Field Programmable Gates Array(FPGA)