电子工业用引线框架铜合金及组织的研究

Progress of Study on Lead Frame Copper Alloy and Its Implementation in Electronic Industry

随着电子信息产品向小型化、薄型化、轻量化和智能化发展 ,对引线框架材料的强度和导电性提出了更高要求。本文在简单介绍电子工业用合金发展的基础上 ,较详细地介绍了日本推出的引线框架合金品种及主要成分、抗拉强度和导电率。同时 ,阐述了引线框架材料的特点和提高材料性能的可能途径 :改变合金的成分 ;采取合理的热处理及加工方法改变其组织结构 ,如固溶强化、析出强化、斯皮诺达分解、弥散强化等。采用几种强化机制适当组合 ,能够大幅度改善材料的抗拉强度和导电率。

As the development of electronic industries, the product becomes smaller, thinner, lighter and intelligent. A problem that how to make the higher intensity and higher conductivity rises. The development history of lead frame copper alloy was introduced. The compositions, intensity and conductivity of lead frame copper alloy were analyzed in detail. The problems that how to get lead frame copper alloy with higher performances, such as solution streng thening, segregation strengthening, dispersion strengthening, etc., were discussed. When a comprehensive strengthening procedure is used, the tensile strength and conductivity of materials may be improved significantly.