低表面附着铜含量的铝阴极箔研究

The Study on Low-copper Residue on the Surface of Aluminum Cathode Foil

利用铝铜合金电子铝箔生产的铝电解电容器用阴极箔的表面附着铜含量一般高达50mg/m2以上。研究了该类阴极箔表面附着铜的来源,提出了用浓硝酸清洗附着铜的方法。实验结果表明,箔表面大部分附着铜由腐蚀过程中的铜沉积产生;通过调整硝酸浸洗体系的含量、温度和浸洗时间等参数,可将铝箔表面的附着铜含量大幅度降低至5mg/m2以下,而阴极箔的其它性能不受影响。

The content of copper residue on the surface of the electrolytic capacitor cathode foil of aluminum-copper alloy is usually more than 50 mg/m2. The source of copper residue is discussed. A method for removing copper residue by concentrated nitric acid is represented. The experimental results show that the copper residue is mainly caused by redeposition of copper ions in the etching process. The content of copper residue can be reduced to 5 mg/m2 by the optimizing concentration, temperature and immersing time of nitric acid, without impairing the other performances.