摘要
通过对低Sn强化磷青铜与插接器端子传统用铜合金材料在使用性能、化学成分等方面的分析比较,研究得出化学成分2%Sn、0.1%Fe、0.03%P对低Sn强化磷青铜性能的影响。Fe2P对基体材料的时效硬化、Sn对基体材料的固溶强化,使得低Sn强化,磷青铜在插接器端子日益小型化、高稳定性、优良导电性等的发展方向上,具有更广泛的优势。
In the research of the materials for the conductor terminal,the comparative analysis is done between the phosphor bronze strengthened with low tin and the conventional copper alloy on their performances and the chemical composition,thus comes to a result that the composition of2%Sn,0.1%Fe and0.03%P affects the performance of the phosphor bronze.The precipitation hardening made by Fe2P and the solid solution hardening by Sn will make the phosphor bronze have more advantages in the trend of smaller size,high stable performance and fine electric conductivity of the conductor terminal.
出处
《汽车电器》
2003年第6期16-19,共4页
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