陶瓷微通道内的传热和压降特性

HEAT TRANSFER AND PRESSURE DROP IN CERAMIC MICROCHANNEL

本文对一种新型陶瓷微通道换热器的传热与流动阻力特性进行了实验研究。实验工质分别为3M公司的HFE-7100和水。对于HFE7100流体,在传热面温度为40℃时热流密度可达10W/cm^2;对于水,传热面温度为35℃时热流密度可达约13W/cm^2。流动阻力特性实验结果表明,无论对于水还是HFE7100流体,在本实验范围内压降小于4.8kPa。

In this paper, we demonstrated the feasibility of using a ceramic microchannel heat sink module for cooling high-power components, such as fuel cells, CPU's and power supplies. Our experiments validated the heat fluxes obtainable with a ceramic microchannel. The heat transfer rate for a microchannel heat sink module reaches 10 W/cm2 using a 3 M thermal fluid (HFE7100) at a wall temperature of 40℃. For the water as the working fluid, the heat flux was 13 W/cm2 at a wall temperature of 35℃. But the pressure drop in the microchannels is less than 4.8 kPa in current test ranges.