基于机器视觉的BGA连接器焊球检测

Machine-Vision-Based Measurement of BGA Connector Solder Balls

文章提出了一种基于机器视觉的BGA器件焊球质量检测方法。该方法在同一视点下,用相同光源分别以两种不同入射方向角照射被测BGA连接器焊球,获得两幅图像,然后得到BGA连接器焊球在x方向的曲面信息,以此计算出被测焊球的主要质量参数。最后给出了BGA连接器焊球检测的主要算法。

This article presents the principle and application of a machine-vision-based method of measuring the quali-ty of solder ball of BGA devices.The method first acquires two images of a BGA connector respectively with the same light source but different light angles,obtains from the two images the information on surfaces of solder balls and calcu-lates the chief quality parameters of the solder balls in the end.The main algorithm measuring the solder balls is given in the article.