物理学与新型(功能)材料专题系列介绍(Ⅰ) 金刚石薄膜能成为新一代半导体材料吗?

Diamond Film-a New Generation Semiconductor?

自从８０年代金刚石薄膜的低压化学汽相淀积获得成功以来，人们对用金刚石薄膜制作高温、高速和大功率器件产生了浓厚的兴趣，因为金刚石的禁带宽，载流子迁移率高，同时具有优异的热学、光学和力学性质．本文对金刚石的电子学特征和金刚石器件的研制现伏作了评述，对发展金刚石器件的若干问题特别是金刚石薄膜的ｎ型掺杂、金刚石膜的异质外延和降低缺陷浓度等作了分析和讨论．金刚石薄膜是一种潜在的新型半导体材料，但要实现器件应用尚需作大量的材料研究．

The success in preparation of diamond film by chemical vapor deposition has stimulated its use in electronic devices such as high-temperature, high-speed and high-power devices due to its wide bandgap, exceptional thermal conductivity and carrier mobility. In this paper the electronic properties of diamond and the research into the fabrication of diamond devi- ces are reviewed. Some problems in the development of such devices especially n-type do- ping and heteroepitaxial growth are discussed. It is be1ieved that diamond film is a pote- ntial semiconducting material but considerable research effort is still required.