Zn对Sn-Ag-Bi系软钎料钎焊性能影响的研究

Effect of Zn on the Solderability of the Sn-Ag-Bi Solders

钎料的钎焊性能很大程度取决于钎料对基板上的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。通过建立简化的数学模型,得出了润湿角θ与钎料熔滴铺展面积间的数学关系式。并采用铺展面积法对Sn-Ag-Bi系钎料钎焊性能进行评估,结果表明在添加1%的Zn,可提高钎料的润湿性能,并可减少Bi的用量。

The solderability of electronic solders depends to a great extent on the wettability, which relates to solid, liquid and gas interfacial tensions of the melted solders on substrates. The relationship between the wetting angle (θ) and spreading areas (S) was set up by mathematical model. The spreading area was used to evaluate the solderability of the Sn-Ag-Bi family of solder. The results indicated that Zn with the the amount of 1% ,can improved the solderability of the Sn-Ag-Bi solders. 