摘要
The Pd/W/Si(lll) interface reaction has been investigated by XRD, XPS and AES. As the annealing temperature was low, no reaction among Pd, W and Si can be detected, but W started to diffuse into Pd and Si started to diffuse into. W. When the annealing temperature was raised, Pd and W were mixed and Pd diffused into Si substrate. When the annealing temperature was raised further, the interface reaction leads to a redistribution of the two metals with accumulation of the refractory metal at the outer layer, such a layer can be used as a diffusion barrier to protect the inner shallow contact layer.
The Pd/W/Si(lll) interface reaction has been investigated by XRD, XPS and AES. As the annealing temperature was low, no reaction among Pd, W and Si can be detected, but W started to diffuse into Pd and Si started to diffuse into. W. When the annealing temperature was raised, Pd and W were mixed and Pd diffused into Si substrate. When the annealing temperature was raised further, the interface reaction leads to a redistribution of the two metals with accumulation of the refractory metal at the outer layer, such a layer can be used as a diffusion barrier to protect the inner shallow contact layer.
出处
《物理学报》
SCIE
EI
CAS
CSCD
北大核心
1992年第11期1849-1855,共7页
Acta Physica Sinica
基金
中国科学技术大学结构分析开放研究实验室科研基金
