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A New Model of Interfacial Physical Contact in Diffusion Bonding 被引量:1

A New Model of Interfacial Physical Contact in Diffusion Bonding
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摘要 Through eliminating voids not affecting the primary bonding process, and incorporating interlayer and flexible base material, the interface geometry character and brief mathematics process were put forth. Through analyzing contact process of diffusion bonding, contact area model was settled. It can interpret the phenomenon of different interface areas taking on different strengths. In the course of physical contact, shear stresses serve an important function for the plastic deformation and the cohesion of interface voids. Through eliminating voids not affecting the primary bonding process, and incorporating interlayer and flexible base material, the interface geometry character and brief mathematics process were put forth. Through analyzing contact process of diffusion bonding, contact area model was settled. It can interpret the phenomenon of different interface areas taking on different strengths. In the course of physical contact, shear stresses serve an important function for the plastic deformation and the cohesion of interface voids.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2004年第1期109-112,共4页 材料科学技术(英文版)
关键词 Diffusion bonding Physical contact Interface layer Diffusion bonding, Physical contact, Interface layer
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  • 1Y.Takahashi and K.lnoue: Mater. Science and Technology . 1992

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