摘要
针对在新产品开发中,SMT印制电路板上常见的影响焊接质量的焊盘设计中的失误,归纳并提出务必特别注意的若干问题。
Aim at common defaults in SMT Pad design which may affect the solder quality in developing new products.Sum up and put forward some questions that should be pay special attention in SMT Pad design.
出处
《电子工艺技术》
2003年第3期106-108,共3页
Electronics Process Technology