摘要
讨论了BGA器件的种类和特性,同时对BGA器件的焊接、验收标准等技术进行了分析,也论述了BGA器件的返修、及其相应的返修工艺。
Introduce the types and the features of BGA,analysesthe soldering technology of BGA and the acceptable standard of BGA,at the same time state the rework process of BGA.
出处
《电子工艺技术》
2003年第3期109-111,共3页
Electronics Process Technology
关键词
BGA
焊接
接收标准
返修
BGA
Solder
Acceptable Standard
Rework
