摘要
基于迹线分析法 ,开发了一种不需衍射花样的铸造合金晶体取向测算程序。应用该程序 ,对镍基高温合金CMSX 2测算了单晶试棒生长方向与 [0 0 1]晶向之间的夹角 ,以及定向切割所需的夹角。与X射线劳厄背射法及菊池花样分析等方法的计算值进行比较 ,本方法及相关程序的测算结果可靠 。
Based on the trace analysis, a computer program is developed to determine crystallographic orientations without using diffraction patterns. As an example, the angles between the growth direction of single crystal bars and the orientation [001], and the ones needed for directional cutting are measured and calculated on single crystals of superalloy CMSX 2. As compared to x ray laue back reflection and the kikuchi diffraction methods, the present results and the corresponding program are reliable. Their application shows remarkable advantages.
出处
《理化检验（物理分册）》
CAS
2003年第5期240-245,共6页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
