摘要
利用固相烧结的方法将铜和镍混合粉制成块状烧结体 ,用光镜、电镜和X射线衍射仪研究了铜 镍烧结体的密度和硬度 ,以及烧结过程中铜粉和镍粉颗粒之间界面的迁移情况。研究发现 ,铜粉和镍粉烧结体的密度和硬度随烧结温度的升高和保温时间的延长 ,以及含镍量的增加呈现下降的趋势。铜粉和镍粉在反应过程中 ,只有镍粉颗粒进入铜粉颗粒、铜几乎不进入镍 ,界面单向迁移。
By the method of solid sintering, bulk Cu-Ni sinter was made with Cu-powder and Ni powder. The density and hardness of sinter and the interface migration course for the powder sinter were studied with OM, SEM and X-ray diffraction. The results showed that the density and hardness of Cu-Ni sinter had a tendency to decrease with the increasing of sintering temperature and prolong of the sintering time and the increasing of Ni contents. Because the interface migration is unidirectional, so only Ni can diffuse into Cu powder and the Cu can′t diffuse almost into the Ni powder.
出处
《理化检验（物理分册）》
CAS
2003年第6期284-287,共4页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
基金
国家自然科学基金资助 (5 98710 31)
