纳米级羟基磷灰石复合正畸黏接剂的黏接强度测试

Study on Bonding Strength of TF Adhesive Compounded with Nanograde Hydroxyapatite

将纳米级的羟基磷灰石作为填料按不同的比例 (10 %、2 0 %、30 %重量比 )与 TF正畸黏接剂复合 ,对其黏接性能分别进行拉伸强度和剪切强度测试 ,结果显示 :纳米级填料的加入不影响黏接剂的储存、凝固时间 ,不同比例的纳米级羟基磷灰石的复合可以提高该黏接剂的黏接强度 ,纳米级羟基磷灰石的加入量为 10 %时黏接剂获得最佳黏接性能。

TF no-mix orthodontic adhesive was compounded in different weight proportion of nanograde hydroxyapatite as 10%, 20% and 30%, for use in this comparative study on composites. 80 orthodontic brackets were cemented and divided into 8 experimental groups, and TF adhesive was set as the control group. The tensile strength and shear strength were tested respectively. The results show that the group of 10% nanograde hydroxyapatite has the greatest bonding strength (9.668±1.0649 MPa in tensile strength and 11.991±1.4135 MPa in shear strength), and there is significant difference between the 10% group and the other groups (P is less than 0.05, one-way ANAOV). It was concluded that the bonding strength can be enhanced when TF adhesive is compounded in suitable proportion of nanograde hydroxyapatitie.