应用于MEMS气密性封装测试的微型湿度传感器的设计与制作

Design and fabrication of humidity sensor for MEMS hermetic package test

MEMS器件的封装一直是MEMS技术的难点之一 ,在封装设计中 ,如何测试封装的有效性就显得尤为重要。本文叙述了一种基于MEMS技术的微型湿度传感器的原理、设计以及工艺流程。在其上进行气密性封装 ,则可通过对封装内的湿度测量来判断该封装的气密性能。在设计中 ,充分考虑了尺寸、工艺以及灵敏度等各方面要求。制作采用的是传统的光刻、刻蚀工艺。该湿度传感器结构简单 ,易于制作 。

The package is always the key problem of the MEMS technology, so in the design of package, the test is very important. Here, a humidity sensor used for MEMS package test is represented, and its principle, design and technics are described in detail. The humidity sensor can be integrated inside the hermetic package which can be tested to see if the package is good at hermeticity by measuring results of the humidity sensor. In the design, the dimension, the technics and the sensitivity are considered comprehensively. The sensor is fabricated by traditional lithography and etching. The humidity sensor is simple in structure, and easy in fabrication, and the sensitivity of it can match the demand of the test of MEMS hermetic package.