表面加工多晶硅薄膜热导率测试结构

Test structure for determination of thermal conductivity of surface micromachined polysilicon thin films

提出了一种使用表面加工工艺设计多晶硅薄膜热导率的测试结构 ,论文推导了热学模型 ,给出了测试方法。由于其制造工艺能和其它微机械器件制造工艺完全兼容 。

A new test structure for measuring thermal conductivity of polysilicon thin films by using surface micromachining process is proposed.The measuring method and thermal modeling are given. Since the process is compatible with other micromachining process, so it can be applied for monitoring the micromechanical processing and on line testing.