可优化PCB检测的X射线系统

X-ray Systems Used to Optimize PCB Inspection

如今很多电子产品制造商已经意识到,有必要在印刷电路板(PCB)组装线上采用X射线检测系统。大多数X射线检测系统能够非常有效的发现单面印刷电路板中的焊点搭桥、漏焊以及直线对准偏差等错误。但并非每一个X射线系统都能进行所有这些检测,而且专用系统价位更高,但高成本并不意味着测试结果更精确。三维系统和使用OVHM技术的二维系统各有所长。

Many electronics manufacturers realized it is necessary to implement the X-ray inspection systems in the PCB assembly line.Most the X-ray inspection systems can find the faults such as solder bridges(shorts), missing or undersized solderjoints(voids), misalignments, open solder joints and bad wetting. However, not every x-ray system can do all theseinspections, and, just because a specific system has a higher price, cost does not ensure an accurate test. 3-D and 2-D systemsare two options.