摘要
RFID的产业链主要由芯片设计、标签封装、读写设备的设计和制造、系统集成、中间件、应用软件等环节组成。从硬件的角度看,电子标签的封装在标签成本中占据了三分之二的比重,在RFID产业链中占有重要的地位。本文详细介绍了不同用途电子标签的形态差异,选择电子标签封装工艺的方法,封装工艺具体环节,行业发展现状,特色企业等相关信息。
RFID's industrial chain is composed by many sectionssuch as design of chips,tags package,design of readingand writing equipment,integration of system,interfaceequipment,software.From the angle of hardware,cost oftag package will account for 2/3 of the total cost and playsan important role in RFID's industrial chain.The articleintroduce different types of package process of tags fordifferent ways,methods for selecting package process oftags,detailed sections of package process,status quo ofindustrial development and relevant information of specificenterprises.
