光固化环氧丙烯酸酯/SiO_2杂化材料的研究

Study on UY-curable Epoxy Acrylate/Silica Hybrid Materials

用FTIR、SEM、DSC和TGA表征了光固化环氧丙烯酸酯/SiO_2杂化材料[(EA-TMSPM)/SiO_2],研究了盐酸、γ-甲基丙烯酰氧丙基三甲氧基硅烷(TMSPM)和无机物浓度对(EA-TMSPM)/SiO_2结构与性能的影响。结果表明,无机物浓度高的(EA-TMSPM)/SiO_2杂化体系中SiO_2粒子尺寸略大于无机物浓度低的体系;盐酸和无机物浓度的增加,都可以增强杂化材料的耐磨性。

The FTIR, SEM, DSC and thermogravimetry were used to characterize UV-curable epoxy acrylate/silica hybrid (EA-TMSPM)/SiO2 material. Experiments were carried out to study the effects of hydrochloric acid and TMSPM and inorganic content on the structure and properties of (EA-TMSPM)/SiO2 hybrid materials. The results indicate that the SiO2 particle size of (EA-TMSPM)/SiO2 system became smaller with organic component added. The abrasion resistance of the hybrid materials was also improved with the increasing of HC1 and inorganic content.