成型压力对Y^(3+)掺杂Ba_(0.62)Sr_(0.38)TiO_3陶瓷介电性能的影响

Effects of Molding Pressure on the Dielectric Properties of Y^(3+)-doped Ba_(0.62)Sr_(0.38)TiO_3 Ceramics

以BaCO3、SrCO3和TiO2等为原料,Y2O3为掺杂剂,采用固相合成法制得了(Ba0.62Sr0.38)TiO3介质瓷,研究了不同成型压力对体系介电性能的影响。结果表明:随着成型压力增大,陶瓷片的径向收缩率逐渐减小,在室温及其以上温度范围内的介电常数变化幅度要小于介电峰附近介电常数的变化幅度。由于Y3+的掺杂,介电损耗在0℃以上都保持了较低的值,并且介电损耗随温度的变化具有很好的稳定性,试样Tm随成型压力增大向高温方向移动。

Using BaCO3, SrCO3 and TiO2, et al as crude materials,Y2O3 as dopant,(Ba0.62Sr0.38) TiO3 ceramics were prepared and effects of the molding pressure on their dielectric properties are investigated. The results show that the radial shrinkage of the ceramics is gradually reduced with the molding pressure increasing. The change in the dielectric constants above room temperature is milder than that near the peak temperature. Due to the doping of Y3+, the dielectric loss is very low above 0 ℃, and the variation of dielectric loss with temperature is very stable. It is also found that Tm shifts to higher temperature with the molding pressure increasing.