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Atomic-layer-deposited Al_2O_3 and HfO_2 on InAlAs: A comparative study of interfacial and electrical characteristics 被引量:3

Atomic-layer-deposited Al_2O_3 and HfO_2 on InAlAs: A comparative study of interfacial and electrical characteristics
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摘要 Al2O3and HfO2thin films are separately deposited on n-type InAlAs epitaxial layers by using atomic layer deposition(ALD).The interfacial properties are revealed by angle-resolved x-ray photoelectron spectroscopy(AR-XPS).It is demonstrated that the Al2O3layer can reduce interfacial oxidation and trap charge formation.The gate leakage current densities are 1.37×106A/cm2and 3.22×106A/cm2at+1V for the Al2O3/InAlAs and HfO2/InAlAs MOS capacitors respectively.Compared with the HfO2/InAlAs metal-oxide-semiconductor(MOS) capacitor,the Al2O3/InAlAS MOS capacitor exhibits good electrical properties in reducing gate leakage current,narrowing down the hysteresis loop,shrinking stretch-out of the C-V characteristics,and significantly reducing the oxide trapped charge(Qot) value and the interface state density(Dit). Al_2O_3 and HfO_2 thin films are separately deposited on n-type InAlAs epitaxial layers by using atomic layer deposition(ALD).The interfacial properties are revealed by angle-resolved x-ray photoelectron spectroscopy(AR-XPS).It is demonstrated that the Al_2O_3 layer can reduce interfacial oxidation and trap charge formation.The gate leakage current densities are 1.37×10~6 A/cm^2 and 3.22×10~6 A/cm^2 at+1V for the Al_2O_3/InAlAs and HfO_2/InAlAs MOS capacitors respectively.Compared with the HfO_2/InAlAs metal-oxide-semiconductor(MOS) capacitor,the Al_2O_3/InAlAS MOS capacitor exhibits good electrical properties in reducing gate leakage current,narrowing down the hysteresis loop,shrinking stretch-out of the C-V characteristics,and significantly reducing the oxide trapped charge(Q_(ot)) value and the interface state density(D_(it)).
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第10期459-463,共5页 中国物理B(英文版)
基金 supported by the National Basic Research Program of China(Grant No.2010CB327505) the Advanced Research Foundation of China(Grant No.914xxx803-051xxx111) the National Defense Advance Research Project,China(Grant No.513xxxxx306) the National Natural Science Foundation of China(Grant No.51302215) the Scientific Research Program Funded by Shaanxi Provincial Education Department,China(Grant No.14JK1656) the Science and Technology Project of Shaanxi Province,China(Grant No.2016KRM029)
关键词 high-k dielectric atomic layer deposition In Al As characteristics high-k dielectric atomic layer deposition In Al As characteristics
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  • 1Kuriyama M,et al. The Review of Scientific Instruments . 2000
  • 2Kawai M,et al. The Review of Scientific Instruments . 2000
  • 3Kuriyama M,et al. Fusion Engineering and Design . 1998
  • 4Mizuno M,et al. Plasma Device and Operation . 1994

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