摘要
随着越来越多的国家开始推行禁止使用白炽灯的计划,钨丝白炽灯行将消失,LED灯丝灯将逐步取代钨丝白炽灯。但是,目前散热问题成为影响LED寿命、光效、光衰和色温等技术参数的重要因素。通过对LED灯丝封装中常用的陶瓷基板和玻璃基板这两类不同基板材料进行有限元热学仿真模拟,分析不同封装材料的散热性能。分析结果表明:陶瓷基板的导热系数明显大于玻璃基板,其散热性能优于玻璃基板的散热性能。
As many countries begin to carry out the plan of prohibition of incandescent lamp,LED filament lamps are gradually replacing incandescent lamps.But the heat dissipation of LEDs has a significant influence on LED's operation life,luminous efficacy,lumen decay and color temperature.Through using ANSYS to do finite element thermal simulation for the ceramic and glass substrates in LED package,the article analyses the influence of different packaging materials on LED's heat dissipation.And the experimental results indicated that the heat dissipation performance of the package based on ceramic substrates was better than the package based on glass substrates,and that the ceramic substrates' heat conductivity was bigger than the glass substrates'.
出处
《中国照明电器》
2015年第1期18-20 33,33,共4页
China Light & Lighting
关键词
LED灯丝灯
有限元分析
热仿真
LED filament lamp
finite element analysis
thermal simulation
