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基于LDS工艺的车灯用三维线路板

3D-MID Used for Automotive Lamps Based on LDS Process
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摘要 介绍激光直接成型(Laser Direct Structuring,LDS)工艺的基本原理、材料及工艺过程。以LDS材料为原材料,通过注塑成型、激光化镀、表面贴装等技术完成车灯用三维线路板,结合1款车灯对三维线路板样件进行电气性能和整灯试验并满足试验要求。介绍三维线路板生产过程出现的各种缺陷问题及原因。试验表明,采用新型3D电路线路板配合车灯其他零件基本满足整灯要求,充分说明LDS工艺在车灯运用的可行性。 The basic principle,material and process of the Laser Direct Structuring(LDS) technology are introduced in this article.With LDS materials as raw material,by means of injection molding,laser plating and surface mount techniques,the 3D circuit board for automotive lamp was completed.Tested with the entire lamp,the electrical performance of the 3D circuit board satisfied the requirement of test sample.The various defects problems and reasons of 3D circuit board in the production process are described.The tests show that the new 3D circuit board combined with other parts can meet the basic requirements of the whole lamp.The results suggest that using LDS technology in automotive lighting is feasible.
出处 《中国照明电器》 2015年第1期29-33,共5页 China Light & Lighting
关键词 三维模塑互连器件(3D-MID) 激光直接成型(LDS) 有机金属复合物 化镀 车灯 3D-MID(Three-dimensional Molded Interconnect Device) LDS(Laser Direct Structuring) organic metal complex chemical plating automotive lamp
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参考文献5

  • 1陈东升.激光与聚合物的相互作用(Ⅲ)银选择性活化化学镀在聚酰亚胺薄膜上制作精细线路[D].上海交通大学2006
  • 2曹宇.激光—微笔/微喷直写集成制造MEMS微结构关键技术研究[D].华中科技大学2009
  • 3张玉娜.模塑材料表面导电线路的直写技术研究[D].华中科技大学2012
  • 4Thomas, Werner,Pforr Johannes.Design of power converters on 3D-MIDs for driving three-dimensional LED-lamps. IEEE Energy Conversion Congress and Exposition (ECCE) . 2011
  • 5邢振发.3D-MIDS改性塑料的激光活化和金属化[J].印制电路信息,2003,11(2):37-38. 被引量:14

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