摘要
随着板上芯片(Chip on Board,COB)封装方式越来越普及,LED的功率越来越高,其热量积聚越来越多,导致LED芯片结温大幅升高,从而大大降低了产品使用寿命。因此适当的热管理对COB封装至关重要。通过工程流体动力学(Engineering Fluid Dynamics,EFD)分析软件模拟了不同功率、不同芯片排布及不同芯片数量下COB光源的热量分布状况,并结合芯片本身的光电特性,直观地展示了上述几种因素对COB光源可靠性的影响。试验结果显示,封装基板厚度降低,导热路径通畅,有利于热量的有效传导。
As the COB(chip on board) LEDs becomes more popular and the LED power higher, the signifi cantly increased LED junction temperature caused by heat accumulation will largely reduce its working life. Therefore proper heat management is crucial for COB packages. In this paper, the COB thermal distribution under different power, chip arrays and chip numbers is simulated by using the engineering fl uid dynamics(EFD) software. Combining the COB photoelectric properties, the infl uence of the above factors on its reliability is directly displayed. Results show that thickness reduction of the substrate and unblocked of the heat transfer path will improve the effective heat conduction.
出处
《中国照明电器》
2015年第4期24-28,共5页
China Light & Lighting
