摘要
建立1种大功率白光LED路灯物理模型和热阻网络图,通过数值计算得出温度分布并进行分析,同时对LED路灯测点的实际温度进行取点测量,经过模拟结果和实际测量结果的对比发现两者数据大致吻合。通过改变肋片厚度及数量,模拟出芯片结温变化,分析其对结温的影响。以芯片结温最低为依据,对散热器结构进行优化。
This paper establish a physical model and thermal resistance network diagrams of a high-power white LED street lamp. Its numerical calculated temperature distribution are analyzed and compared with the actual temperature by measuring some points practically. It shows that the simulation data and the obtained actual measurement results were broadly consistent. By varying the number of fi ns and fi n thickness, its infl uence on junction temperature are analyzed with the simulating chip junction temperature changes. The radiator structure is optimized at the basis of the lowest chip junction temperature.
出处
《中国照明电器》
2015年第4期32-34 38,38,共4页
China Light & Lighting
关键词
大功率LED
热阻
结温
散热
high-power LEDs
thermal resistance
junction temperature
heat radiation
