LED模块/模组的结温测量研究

Research on Junction Temperature Measurement of LED Package/LED Module

LED封装、模组以及终端产品LED灯和LED灯具的质量水平,例如发光量、色温等光性能,与LED内部芯片的结温高低密切相关。一般来说结温高,LED性能变差。因此,对于LED芯片企业和LED封装企业,了解LED芯片各层结构的热阻和COB-LED模组中各LED芯片的结温显得十分必要。同样,对于LED灯和LED灯具等终端产品企业,了解掌握LED芯片的结温也显得非常重要。目前现有的测量方法中多是非直接测量和计算,而影响LED结温测量的因素多,看不见、摸不着,导致对测量结果的定量可信度疑问,也就是对测量误差到底是多少心中无数。本文采用的测量方法是对LED封装的LED芯片结温和LED模组中各LED芯片的平均结温的敏感参数在实际的大工作电流下进行直接测量和分析。

The quality level of LED package,module,lamp and luminaire,such as performance of light-emit amount,related color temperature,etc.,is tightly related with the LED junction temperature inside the LEDs.Usually,the higher the junction temperature,the poorer the performance.So for the LED chip enterprise and LED package enterprise,it’s very important to understand the thermal resistance of every layer inside the LED chip and the junction temperature of the LED chip on the COB-LED module,also for the LED lamp and luminaire enterprises.Now there are many factors influencing non-direct measurement and calculating results for the existing measurement methods,we cannot say even roughly how much the measurement difference is.The measurement method of this paper is to measure directly and analyse the LED junction temperature inside the LED package and the average junction temperature inside the LED chips of the module under the actual rated operating condition of the LED.