精密连接——真空扩散焊和过渡液相连接的实验研究

Experimental Study of Exact Welding-Vacuum Diffusion Welding and Transient Liquid Phase Bonding

针对新型电真空器件研制过程中的精密连接要求,进行了无氧铜真空扩散焊、过渡液相连接工艺实验。并应用氦质谱检漏仪、测量显微镜、金相显微镜、扫描电子显微镜对扩散焊试样进行分析,并进行了不同扩散温度、不同扩散时间的对比实验。实验表明:在相同工艺参数下,无氧铜直接扩散连接能获得可靠的扩散焊接头,内部结构变形量1~12μm,漏率5×10-4 Pa·m3s-1,且在相同扩散压力条件下,不能通过提高扩散温度,延长扩散时间的方法获得气密性接头;过渡液相连接接头可达到气密性要求(QL【5×10-9 Pa·m3s-1),变形量5~15μm,镀银层充分扩散到母材中。

In order to exactly weld new types of Vacuum electron devices,this paper studied the diffusion welding and transient liquid phase bonding.The diffusion welding sampleswere analyzed by metallurgical microscope,measuring microscope,helium leak detectors,scanning electron microscopy.And the experiments at different diffusion temperature and diffusion timewere carried out.The results show that,oxygen-free copper diffusion weldingis reliable,and the distortion of internal structure deformation is between 1and 12μm,leakage rate is 5×10-4 Pa·m3s-1.Increasing the diffusion temperature and diffusion time at the same pressure conditionscannot get air-tight joints.Transient Liquid Phase bondingcan obtain the joint airproof(QL<5×10-9 Pa·m3s-1),deformation is 5~15μm,plating silver layer is sufficiently diffused into the base material.