摘要
以氧化铍、碳化硅为原料,采用热压烧结工艺,在1800~1900℃,氮气气氛下制备BeO-SiC复合材料。采用网络分析以及激光热导仪等检测仪器,研究了热压烧结制备的材料的微波衰减性能及导热性能。研究结果表明:采用热压烧结工艺可以在1800~1900℃制备组织致密均匀的BeO-SiC复合材料;采用SiC为原料的BeO-SiC复合材料具有适当的介电性能和良好的导热性能。
With BeO and SiC as raw materials,BeO-SiC composites were prepared by hot-pressing process in nitrogen atmosphere.The attenuating property and heat conductivity were researched by network analyzer and laser heat conductivity apparatus.The results show that BeO-SiC composites with compact and uniform microstructure can be obtained by hot-pressing sintering at 1800~1900 ℃.The developed BeO-SiC composites exhibit appropriate dielectric property and excellent heat conductivity.
出处
《真空电子技术》
2016年第5期30-32,共3页
Vacuum Electronics