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浸没式光刻的优势和可行性(英文) 被引量:3

Advantage and Feasibility of Immersion Lithography
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摘要 浸没式光刻通过高折射率的液体充入透镜底部和片子之间的空间使光学系统的数值孔径具有显著的优势。在193nm曝光系统中,水(折射率为1.44)被选作最佳的浸入液体。通过成像模拟,现已证明ArF穴193nm雪浸没式光刻(NA=1.05~1.23)与F2穴157nm雪干法穴NA=0.85~0.93雪光刻具有几乎相同的成像性能。结合流体力学和热模拟结果,讨论了ArF浸没式曝光设备的优势和可行性。 Immersion lithography has advantage in the numerical aperture of optics by a factor of refractive index n of the liquid filled into the space between the bottom lens and wafer.In case of193nm exposure tools,water(n=1.44)has been found as the best liquid.It is shown,by using imaging simulations,that ArF(193nm)immersion lithography(NA=1.05to1.23)has almost equivalent performance to F 2 (157nm)dry(NA=0.85to0.93)lithography.Issues in the ArF immersion exposure tools are discussed with fluid-dynamic and thermal simulations results
机构地区 Nikon Corporation
出处 《电子工业专用设备》 2004年第2期10-14,18,共6页 Equipment for Electronic Products Manufacturing
关键词 193nm光刻 浸没透镜曝光 折射率 数值孔径 nm lithography Immersion exposure Index of refraction Numerical aperture
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参考文献5

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同被引文献16

  • 1张鸿海,胡晓峰,范细秋,刘胜.纳米压印光刻技术的研究[J].华中科技大学学报(自然科学版),2004,32(12):57-59. 被引量:12
  • 2莫大康.无掩模光刻技术的最新进展[J].电子工业专用设备,2005,34(2):1-2. 被引量:4
  • 3[1]SWTKES M,ROTHSCHILD M.Immersion lithography at 157 nm [J].J Vac Sci Tech,2001,B19 (6):2353-2356.
  • 4[4]LIN B.TSMC plan with immersion lithography [A].Litho Forum by international SEMATECH [C].Los Angeles,USA:2004.27-29.
  • 5[6]DERBYSHIRE K.Optical lithography's liquid future [ J].Semiconductor Manufacturing,March 2004,5 (3):18-30.
  • 6INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS 2004 UPDATE Lithography [EB/OL].http:∥www.itrs.net/Common/2004Update/2004Update.htm, 2005-10-27.
  • 7Harry Sewell, Dianne McCafferty, Louis Markoya. Immersion Lithography Next Step on the Roadmap [R]. Brewer Science ARC Symposium, Albany, 2004-10-28.
  • 8Yasuhiro Horiike, Masashi Ogawa, EUVA. Development Of Extreme Ultraviolet Lithography In Japan[J/OL]. Future Fab Intl, Volume 18. http:∥www.future-fab.com, 2005-1-12.
  • 9Walter Trybula, International SEMATECH. Directions in Maskless Lithography[J/OL]. Future Fab Intl, Volume 19,June 28, 2005. http:∥www.future-fab.com,2005-6-28.
  • 10Ernest J. Fantner and Hans Loeschner, IMS Nanofabrication GmbH. New Tools for Nanotechnology[EB/OL]. http:∥www.ims.co.at/,2005 -03 -09.

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