摘要
制作高密度互连衬底依靠细线条印刷电路板技术,这种技术带来了非常严格的类似线间距变窄到50～15μm时的成品率问题。几何图形、形状、材料和表面抛光有关的细线条面板对光学检查提出了新的挑战,需要新的方法来保证可靠的检查。这种挑战是由生产因素产生的,例如导体线条的高宽比、在半添加加工中电镀线条的拱形顶部、有光泽或半透明的薄片和嵌入式无源元件等。其他的挑战来自物理和光学极限,即对于非常小的细线条缺陷需要达到很高的放大倍率才能查出。
Manufacturing high-density interconnect(HDI)substrates relies on fine line PCB technology.This technology brings more severe yield issues as line space gets narrow below50 μ m toward15 μ m.The geometries,shapes,materials and surface finishes involved in fine line panels pose new challenges to optical inspection,requiring novel solutions to ensure reliable detection.Some of these challenges result from factors of the product,such as high aspect ratio of conductor lines,vaulted(curved)top surface of lines plated in semi-additive process,shiny or translucent laminate,and embedded passives.Other challenges come from limitations in the physics of optics that are reached at the high magnification required for very small dimensions of fine line defects.
出处
《电子工业专用设备》
2004年第2期59-65,共7页
Equipment for Electronic Products Manufacturing
