步进扫描光刻机同步控制及硅片变形误差补偿技术研究

Study on the Synchronizing Control and Wafer Deformation Error Compensation Technology for Step Scanning Photoetching Machine

在建立光刻机工作台、掩膜台的运动控制模型基础上 ,提出工作台二级进给控制策略及工作台、掩膜台同步控制策略 ,并且通过自适应同步控制和逐场对准方式下分段误差校正技术对硅片变形进行补偿。实验证实 ,当硅片非线性变形占总变形的比例分别为 1 0 %、30 %、5 0 %时 ,通过以上方法能够补偿的不同步误差分别为 98.4%、96.3%和 94.2 %。

On the basis of establishing the kinematics model of wafer table & mask table, the control strategies of two-stage feed for wafer table and synchronizing wafer table with mask table were presented. Meantime, the wafer deformation was compensated by means of an adaptive synchronizing control & piecewise error revision technology based on aligning field by field. The experimental results indicate: when the ratio of wafer non-linear deformation to total deformation is 10%,30% & 50% , 98.4%,96.3 % & 94.2 % of non-synchronizing errors can be compensated respectively by using the above method.