摘要
研究了硫代硫酸钠无氰镀银工艺中各组分含量的变化对银镀层在附着力、光亮度等性能的影响 ,获得各自的最佳配比 ;通过改变阴极电流密度、pH值 ,考察对银镀层质量的影响 ,得到最佳的硫代硫酸钠无氰镀银工艺。
The effects of variations in the content of each bath component on adhesion, brightness, etc. of silver coating are studied, obtaining an optimum component proportion. By evaluating the quality of coating under different current densities and pH values, an optimal sodium thiosulphate cyanide-free silver plating process is acquired.
出处
《电镀与环保》
CAS
CSCD
2004年第1期15-16,共2页
Electroplating & Pollution Control
关键词
硫代硫酸钠
无氰镀银
外观
结合力
电沉积速度
阴极电流效率
Sodium thiosulphate
Cyanide-free silver plating
Appearance
Adhesion
Electrodeposition rate
Cathodic current efficiency
