摘要
The electroless deposition process of copper plating consisting of TEA and EDTA as complexing agents,paraformaldehyde as reducing agent,and 2-mercaptobenzothiozole as stabilizer and gelatin and animal glue as additives was investigated.The stability of the electroless copper solution was monitored by measuring the absorbance of the solution with a UV-Visible spectrophotometer and the solution was quite stable up to 15 h.The adhesion of copper films on mild steel foil was assessed by standard bend test and exhibited good adhesion.The XRD results indicate that the copper films have a(111) texture.Moreover,the additives suppress the predominant(111) plane crystal growth and increase the rate of(220) texture crystal growth.The crystal size of the copper films was calculated using the Scherrer formula from the predominant peak.SEM and AFM studies reveal that these two additives modify the crystal structure,grain size and surface morphology of the copper films.The cyclic voltammetry studies reveal that the additives are adsorbed on the electrode surface and inhibit the rate of deposition.Potentiodynamic polarization and electrochemical impedance studies reveal that the deposits produced in the presence of additives display higher corrosion resistance.
研究了以TEA和EDTA为络合剂、多聚甲醛为还原剂、二硫基苯并噻唑为稳定剂、凝胶和动物胶为添加剂的镀铜化学沉积过程。化学镀铜溶液的稳定性可通过紫外可见分光光度仪测量溶液的吸光度来监测,在15 h内溶液都相当稳定。采用标准弯曲试验评估在低碳钢箔上铜膜的附着力,显示了很好的吸附性。XRD结果表明,铜膜具有(111)织构,而且,添加剂能够抑制(111)面的优先晶体生长,提高(220)织构的晶体生长速度。利用Scherrer公式从主峰计算铜膜的晶粒尺寸。SEM和AFM研究表明,这两种添加剂能够改善铜膜的晶体结构、晶粒尺寸和表面形貌。循环伏安法研究表明,添加剂能够被吸附在电极表面并降低沉积速率。动电位极化和电化学阻抗研究表明,有添加剂时产生的沉淀具有更高的耐腐蚀性。
