AlTiN-Cu涂层的组织结构和性能

Microstructure and properties of AlTiN-Cu coating

采用阴极弧离子镀法在硬质合金基体上分别沉积AlTiN与AlTiN-Cu涂层,利用XRD、SEM、EDS、XPS、纳米压痕与切削实验等对比研究AlTiN涂层和AlTiN-Cu涂层的显微组织与切削性能。结果表明:AlTiN涂层为典型柱状晶粒结构,Cu的引入改变AlTiN涂层的晶粒生长方式与择优取向,细化晶粒组织,降低涂层硬度。对比AlTiN与AlTiN-Cu涂层可转位硬质合金刀片的切削性能发现,由于金属铜的润滑作用,AlTiN-Cu涂层在干式切削时切削寿命提高44%;Cu的引入导致涂层硬度降低,AlTiN涂层在湿式切削时性能更佳。

AlTiN and AlTiN-Cu coatings were deposited on cemented carbide substrates with cathodic arc ion plating. The properties of coatings were studied by X-ray diffractometry(XRD), scanning electron microscopy(SEM), energy dispersive X-ray spectroscopy(EDX), X-ray photoelectron spectroscopy(XPS), nanoindentation and cutting tests. The results show that AlTiN coating is typical columnar structure, Cu changes the grain growth way and preferred orientation, refines the grain sizes of the coating and reduces the coating hardness. AlTiN layer and AlTiN-Cu layer applied on the indexable inserts were compared in cutting tests. The AlTiN-Cu coatings cutting life is improved by 44% under conditions of dry cutting, which is caused by the effect of the lubrication of copper. Whereas, the AlTiN coatings are more successful at wet cutting, it can be attributed to the addition of Cu decreases the hardness of the coatings.