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液固分离法制备金刚石/铝封装材料的组织与性能 被引量:3

Microstructures and properties of diamond/Al composites prepared by liquid-solid separation technology
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摘要 采用高性价比液固分离法(LSS)制备高性能金刚石/铝散热基板,研究金刚石镀铜对复合材料界面结合和导热性能的影响,利用SEM、EMPA、XRD分析复合材料的断口形貌及界面行为。结果表明:镀层元素向基体扩散与基体铝形成Al_2Cu_4化合物,中间相增强两相界面结合,改善材料性能。金刚石镀铜处理后,复合材料致密度提高1.16%,热导率提高9.50%,抗拉强度提高17.39%,复合材料的热物理性能优于CE13合金的。用Maxwell、Kerner理论模拟预测热导率(TC)、热膨胀系数(CTE)与实际测量结果相一致。 High performance diamond/Al composites for heat dissipation were manufactured by advanced cost-effective liquid-solid separation(LSS) technology. The effect of Cu coating on the interface bonding and thermal conductivity of composite materials were researched. The fracture morphology and interfacial behavior of composite materials were analyzed by SEM, EMPA and XRD. The result show that the Al_2Cu_4 compounds form from coating element diffuse and Al matrix, which can enhance the interfacial bonding between the two phases and improve the properties of the materials. After Cu coating, the density of the composites increases by 1.16%, the thermal conductivity increases by 9.50%, the tensile strength increases by 17.39%. The thermal physical properties of Cu-diamond/Al are better than that of CE13(controlled expansion) alloy. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion of diamond/Al composites show the similar tendency with those by Maxwell and Kerner models, respectively.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2017年第9期1855-1861,共7页 The Chinese Journal of Nonferrous Metals
基金 北京市教育委员会科学研究项目(Z121100001312012)~~
关键词 金刚石/铝复合材料 液固分离法 镀层 热导率 热膨胀系数 电子封装 diamond/Al composites liquid-solid separation technology coating thermal conductivity coefficient of thermal expansion electronic packaging
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