MOCVD用钨中圈变形失效组织分析

Metallographic Analysis of Deformation Failure of Tungsten Ring for MOCVD

针对MOCVD外延设备使用国产钨中圈寿命较短的问题,对进口和国产钨中圈进行了金相检测对比分析,并使用ansys软件对钨中圈使用过程中各位置温度变化进行了计算机模拟。结果表明,钨中圈使用失效后,组织由长条状纤维组织转变为等轴晶,部分组织发生了二次再结晶;钨中圈各个位置的晶粒长大的程度不同,这是导致钨中圈的不均匀变形的主要原因,当变形达到一定程度后,钨中圈将失效;国产钨中圈原始组织为轧制态的长条状纤维组织,进口钨中圈原始组织存在一定程度的再结晶,可有效降低并推迟二次再结晶的发生,提高钨中圈使用寿命。

To solve the problem of short life of domestic tungsten midring in MOCVD epitaxial equipment,metallographic detection and comparative analysis of imported and domestic tungsten midring were conducted.Using analysis software,the temperature change of tungsten middle ring was simulated.The results show that the microstructure changed from long fiber to equiaxial crystal after the failure of tungsten ring,and some of the microstructure underwent secondary recrystallization.The grain size varies at different positions in the tungsten midring,which is the main reason for the uneven deformation of the tungsten midring.The original structure of domestic tungsten midring is a long fiber structure in rolling state.The recrystallization of imported tungsten middle ring original structure can effectively reduce and delay the occurrence of secondary recrystallization and improve the service life of tungsten midring.