期刊文献+

电沉积Ni-P合金初期沉积行为的研究 被引量:6

STUDY ON THE INITIAL ELECTRO-DEPOSITION BEHAVIOR OF Ni-P ALLOY
下载PDF
导出
摘要 对Ni-P合金在 4 5钢基体表面的初期沉积行为进行了观察与分析 ,发现电沉积Ni-P合金镀层的初期沉积行为受到基体材料组织的影响 .在退火态 4 5钢表面 ,Ni-P合金镀层优先在晶界及渗碳体表面形核 .由于珠光体组织中含有渗碳体相且具有比较高的晶界密度 ,因而在沉积初期镀层优先形核和生长 .镀层在基体表面是以纳米尺度的晶粒聚集在一起形成的多晶体形式存在的 .随着施镀时间的延长 ,纳米晶多晶体在侧向二维生长的同时 。 In this paper,study on the initial electro-deposition behavior of Ni-P alloy on the surface of 45 steel shows that it is influenced by the microstructure of matrix material.As the pearlite in it contains cementite phase and has high crystal boundary density,the nucleation and growth of deposits prefer to occur at the pearlite at the beginning during deposition on the surface of annealed 45 steel.The coating exists in form of nano-polycrystal layers composed by gathering of nano-sized crystals.With plating time going on,the nano-polycrystal gathering grows in two dimensions,and the new nano-polycrystal layer appears simultaneously on the formerly formed nano-polycrystal surface.
出处 《中国腐蚀与防护学报》 CAS CSCD 2004年第1期6-9,共4页 Journal of Chinese Society For Corrosion and Protection
基金 河北省自然科学基金 ( 5 992 3 7)
关键词 NI-P合金 组织涂层 电沉积 Ni-P alloy,microstructure,coating,electro-deposition
  • 相关文献

参考文献10

  • 1于维平,段淑贞.电沉积Ni—P非晶态合金的初期结构及形成机理[J].材料研究学报,1996,10(4):419-422. 被引量:17
  • 2Osaka T,Yamazaki T.Metallization of AlN ceramics by electroless Ni-P plating[J].J.Electrochem.Soc.,1986,133 (11):2345-2347
  • 3Marton J P,Schlesinger M.The nucleation growth and structure of thin N I-P films[J].J.Electrochem.Soc.,1968,115 (1):16-21
  • 4Flis J,Duquette D J.Nucleation and growth of electroless nickel deposits on molybdenum activated with palladium[J].Ibid,1984,131(1):51-57
  • 5Sricharoenchaikit P.Thin metal film formation using electroless plating[J].Ibid,1993,140(7):1917-1921
  • 6Severin J W.A study on changes in surface chemistry during the initial stages of electroless Ni(P) deposition on alumina[J].Ibid,1993,140(3):682-687
  • 7Homma T.Transmission electron microscopy study of electroless Ni -P and Cu films at initial deposition stage[J ].J.Electrochem.Soc.,199,138(5):1269-1274
  • 8Besenhard J O.A STM study of Pd-catalyst for electroless Ni-P and Cu deposition on nonconductors by means of a modified graphite substrate[J].Ibid,1989,136(12):3608-3610
  • 9Osaka T.STM observation of electroless-plated cobalt alloy thin films[J].Japanese J.Appl.Phy.,1989,28(3):L465-467
  • 10Homma T,Yamazaki T,Osaka T.An in-situ study on electroless -deposition process by scanning tunneling microscopy[J].J.Electrochem.Soc.,1992,139(3):732-736

二级参考文献1

  • 1团体著者,物理金属学.中,1986年

共引文献20

同被引文献53

引证文献6

二级引证文献34

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部