摘要
球栅阵列技术已经激起了电子行业的人们强烈的兴趣。随着人们的目光愈来愈多地关注于BGA器件的组装的时候,对BGA器件进行组装时所产生的清洗和干燥的问题受到了人们广泛的关注,各种各样的BGA器件和焊膏需要采用合适的清洗处理方法。
Ball grid array (BGA) technology has continued to command an intense level of interest and excitement in the electronics community. While much attention has been given to the assembly of BGAs, the subject of cleaning and drying BGA assemblies has been to pay close attention by one. A wide variety of BGA components and flux types need to be cleaned.
