铜基表面Ni-Si_3N_4纳米复合镀工艺研究

Study on the Preparation Technology of Electrodeposited Ni/Nano Si_3N_4 Composite Coatings on Copper Substrate

在纯铜板上制备了含有纳米Si3N4镍基复合镀层,利用扫描电镜观察镀层表面显微组织。研究了含量、阴极电流密度、pH值、温度、时间、搅拌等主要工艺参数对复合电沉积的影响。并用MM 200磨损试验机检测了所得复合镀层的耐磨性能。结果表明,纳米Si3N4镍基复合镀层成型工艺参数为:电流密度4～10A/dm2,温度30～60℃,pH:3～4,超声波辅助机械搅拌;最佳含量是20g/L。

Ni-based coatings with nanometer Si_3N_4 powder were made on pure copper substrate.The microstructure of the coatings was analyzed by scanning electron microscope(SEM).The effects of content,current density,pH,electrolyte temperature,electrolyte time and stirring on composite electrodepositing were studied.Wear resistance was done for the coatings by MM-200 wear tester.The result showed that the optimum technological parameters of Ni-based coatings with nano meter Si_3N_4 powder were obtained as following : current density 4～10A/dm^2,electrolyte temperature 30～60℃,pH value equals to 3～4,ultrasonic accompanied by mechanical stirring;the optimum content of powder in the electrolyte is 20g/L.